Curriculum Vitae for Stanley Shanfield
Education:
Massachusetts Institute of Technology, Ph.D., Physics, 1981
University of California, Irvine, B.S. Cum Laude, Physics, 1977
Educational Awards:
Outstanding Research Project, U.C. Regents Award, 1977
Phi Beta Kappa, 1977
Four Year Scholarship, Tuition & Research, ERDA/DOE, 1977-1981
Hands-On Professional Expertise:
Semiconductor Physics & Chemistry
Semiconductor Fabrication: Silicon and III-V Materials
Semiconductor Device & Integrated Circuit Engineering
Semiconductor Equipment: Front & Back End
RF Design and Fabrication
Digital Design & Fabrication
Semiconductor Manufacturing in Silicon and III-V Materials
MEMS Design and Fabrication: Electrical, Optical, & Sensing Devices
Fiber Optic Device Design and Fabrication
Integrated Optics & Electro-Optical Devices
Plasma Physics
Specialized Training:
Global Positioning Electronics, Systems and Components
Six Sigma Semiconductor Manufacturing
Microwave Engineering
US Patent Law in Technology
Patent Application and Prosecution
Semiconductor Plasma Processing
Thin Film Physics and Technology
MEMS-based Gyroscopes and Accelerometers
Thermoelectric Materials & Technology
Phased Array Radar Engineering
Antennas and Electromagnetic Propagation
Solid State Optical Devices
Fiber Optic Communication System Operation
HALT and HAST Reliability Testing Methods
Professional Experience:
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Draper Laboratory Cambridge, MA |
2003 - present |
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Division Leader, Advanced Hardware Development |
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Led division (about 80 staff) in re-invigorating multi-chip integrated circuit module facility, more than doubling associated revenues in two years. By most accounts, made division a viable business & technological entity again. Invented & led implementation of an ultra-miniature electronics fabrication technology which became a top laboratory priority. Led team in realization & fabrication of a newly designed precision MEMS-based gyroscope and associated ASIC. Found funding and led team in developing a miniature power source with energy density at least two orders of magnitude higher than any source previously built. Developed fabrication technology for semiconductor-based low phase noise oscillator design, allowing for receiver operation with extremely low signal strength. Awards and recognition received.
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Clarendon Photonics Newton, MA |
2001 - 2003 |
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Director, Packaging & Integration |
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30 person photonic chip startup with $18 million 2nd round funding. Invented and productized new, low cost and reliable semiconductor processing, packaging and pig-tailing technology for optical add-drop multiplexer. Established assembly and packaging process, and developed control electronics. Partner with Micron Technologies, using their R&D semiconductor facility.
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AXSUN Technologies Bedford/Billerica, MA |
1999 - 2001 |
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Vice President, Operations |
1999 - 2000 |
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Initially 3 staff with $6 million funding. Designed, fabricated and productized AXSUN’s micro-electromechanical (MEM) Fabry-Perot optical filter. Patents granted on semiconductor processing and control electronics. Completed facility and semiconductor processing design, then completely equipped. Raised 2nd round funding for $36 million. Established process and fabrication facility in Belfast, Northern Ireland for producing thick oxide silicon-on-insulator material.
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Director, Manufacturing & Wafer Fab Technology |
2000 - 2001 |
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After 3rd round funding, led device manufacturing, creating wafer fab and assembly infrastructure; hired 70+ people, led production. Delivered first generation product for revenue to multiple customers. Converted pure technology to dominant company revenue with high yield. |
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Raytheon Corporation Lexington/Andover, MA |
1985 - 1999 |
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Manager, Semiconductor Operations |
1996 - 1999 |
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Built and led a 300 employee, $60 million revenue 24/7 semiconductor development and manufacturing operation resulting from the consolidation of a number of smaller organizations. Key player in technological development and recipient of Raytheon’s 6 Sigma Leadership training. Decision maker in Texas Instrument group acquisition, providing significant expert opinion on semiconductor and design facilities. Obtained state-of-art yields using best available steppers, deep reactive ion etching, plasma assisted CVD, and ion-implantation equipment, and disciplined design-for-manufacturing circuit design and layout methodology.
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Research Laboratory Manager |
1992 - 1996 |
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Leader of a 90 employee development and contract research organization in high performance semiconductor devices and circuits, measurement, assembly and wafer fab. Led a team which invented and implemented a major revenue generating technology (.$100 million) based on semiconductor device development (pseudomorphic high electron mobility transistor). Increased outside research funding by 50% in 3 years through superior technical performance relative to competitors.
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Section Manager, Semiconductors |
1985 - 1992 |
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Led a MM-Wave Circuit and Module Development program over 2 years leading to production win of a satellite terminal electronics generating $320 million in sales. Developed designed processes for fabricating high power, high frequency multi-function integrated circuits, and combining high performance digital and analog devices in a single integrated circuit.
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Spire Corporation Bedford, MA |
1981 - 1984 |
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Staff Scientist |
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Developed new methods for low temperature deposition of plasma-assisted CVD epitaxial silicon. Wrote joint papers with MIT professor, and had process adopted by equipment manufacturers. Built, operated and characterized ion-assisted deposition system for making coating for semiconductor and machine tool industries. Process eventually purchased by Kennametal, Inc.
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